電子封裝技術專業
一、培養目标
Ⅰ. Program Objective
本專業面向國家集成電路和光電子産業需求，培養身心健康、具有良好的思想品質與職業道德、了解中國國情、擁有國際視野與高度社會責任感，适應社會經濟發展需求的富有創新精神的高素質複合型人才。學生系統學習電子制造科學與工程領域的基礎理論及工程應用知識，能夠從事集成電路制造、電子封裝技術、電子制造裝備及電子工藝材料等領域的科學研究、技術開發、設計制造、企業管理等工作。畢業後，經過磨練，能夠逐步成長為社會的領軍人物。
預期五年以上的畢業生：
（1）能夠系統應用電子封裝技術專業基礎理論知識，具有較強的從事相關專業領域科學研究的能力；
（2）能夠應用電子封裝技術專業的技術知識，解決本專業及相關領域的複雜工程問題；
（3）具有較強的團隊合作意識、溝通與交流能力、社會責任感，能夠組織協調及科學管理多學科項目與團隊；
（4）具有優良的道德品質、科學素質與人文修養，熱愛祖國、在工程實踐中能夠綜合考慮倫理、社會與環境、可持續發展等因素；
（5）具有良好的終身學習、國際視野及開拓創新意識；
（6）具有良好的服務意識，履行社會與公共責任。
This program meets the needs of national emerging strategic industries of Integrated Circuit and Optoelectronic industries. It aims to cultivate high-quality compound talents with innovative spirit, good physical and mental health, good ideological quality and professional ethics, understanding of China's national conditions, international perspective and high sense of social responsibility, and adapting to the needs of social and economic development. The students need to systematically master the basic theory and application knowledge of Electronic Manufacturing Science and Engineering, and can engage in the scientific research, technology development, design and manufacturing, enterprise management of integrated circuit manufacture, electronic packaging, electronic manufacturing equipments and electronic technology materials, etc. After graduation, through hard work and training, the students can gradually grow into a leading figure in society.
Expect students can achieve the following goals after graduated more than five years:
(1) Ability to systematically apply the basic theoretical knowledge of natural sciences and electronic packaging technology, and have a strong ability to engage in scientific research in related fields of specialization;
(2) Ability to apply electronic packaging expertise to solve complex engineering problems in this and other related fields;
(3) Strong teamwork awareness, communication and communication skills, sense of social responsibility, able to organize, coordinate and scientifically manage multidisciplinary projects and teams;
(4) With excellent moral character, scientific quality and humanistic accomplishment, loving of motherland, can comprehensively consider such factors as ethics, society and environment, and sustainable development in engineering practice;
(5) Have a good lifelong learning, international perspective and pioneering and innovative awareness;
(6) Have a good sense of service, fulfill social and public responsibility.
二、基本規格要求
Ⅱ. Learning Outcomes
本專業主要學習電子制造科學與工程和材料工程兩個領域的基礎理論和應用技術，畢業生應獲得如下幾個方面的知識和能力：
（1）能夠将數學、自然科學、工程基礎和專業知識用于解決複雜工程問題。
（2）能夠應用數學、自然科學和工程科學的基本原理，識别、表達、并通過文獻研究分析複雜工程問題，以獲得有效結論。
（3）能夠設計針對複雜電子制造工程問題的解決方案，設計滿足特定需求的系統、單元（部件）或工藝流程，并能夠在設計環節中體現創新意識，考慮法律、健康、安全、文化、社會以及環境等因素。
（4）能夠基于科學原理并采用科學方法對複雜電子制造工程問題進行研究，包括設計實驗、分析與解釋數據、并通過信息綜合得到合理有效的結論。
（5）能夠針對複雜電子制造複雜工程問題，開發、選擇與使用恰當的技術、資源、現代工程工具和信息技術工具，包括對複雜工程問題的預測與模拟，并能夠理解其局限性。
（6）能夠基于工程相關背景知識進行合理分析，評價電子制造工程實踐和複雜電子制造工程問題解決方案對社會、健康、安全、法律以及文化的影響，并理解應承擔的責任。
（7）能夠理解和評價針對複雜電子制造工程問題的工程實踐對環境、社會可持續發展的影響。
（8）具有人文社會科學素養、社會責任感，能夠在工程實踐中理解并遵守工程職業道德和規範，履行責任。
（9）能夠在多學科背景下的團隊中承擔個體、團隊成員以及負責人的角色。
（10）能夠就複雜工程問題與業界同行及社會公衆進行有效溝通和交流，包括撰寫報告和設計文稿、陳述發言、清晰表達或回應指令。并具備一定的國際視野，能夠在跨文化背景下進行溝通和交流。
（11）理解并掌握工程管理原理與經濟決策方法，并能在多學科環境中應用。
（12）具有自主學習和終身學習的意識，有不斷學習和适應發展的能力。
As a student of this program, you will gain:
(1) Able to apply knowledge of mathematics, natural science, engineering fundamentals and expertise to solve complex engineering problems.
(2) Identify, formulate, research on literature and analysis complex engineering problems to reach substantiated conclusions using basic principles of mathematics, natural sciences and engineering sciences.
(3) Find solutions for complex electronic manufacturing engineering problems and design innovative systems, units (components) or processes that meet specific requirements. The solution and design shall factor in legal, health, safety, culture, society, and environmental perspectives.
(4) Conduct investigations of complex electronic manufacturing engineering problems using research-based knowledge and research methods including design of experiments, analysis and interpretation of data, and synthesis of information to obtain reasonable and effective conclusions.
(5) Create, select and apply appropriate techniques, resources, and modern engineering and information analytical tools for complex electronic manufacturing engineering problems, including prediction and simulation of complex engineering problems, and understand their limitations.
(6) Assess appropriately on societal, health, safety, legal and cultural impact and the consequent responsibilities relevant to professional engineering practice and solutions to complex electronic manufacturing engineering problems.
(7) Understand and evaluate the impact of engineering practice on complex electronic manufacturing engineering problems on environmental and social sustainable development.
(8) Apply ethical principles and commit to professional ethics and responsibilities and norms of engineering practice.
(9) Ability to assume the role of individual, team members, and principals in a multidisciplinary team.
(10) Communicate effectively on complex engineering activities with the engineering community and with society at large, such as being able to comprehend and write reports and documentation, make effective presentations, and give and receive clear instructions. Possess a certain degree of global outlook, and be able to communicate across different cultures.
(11) Obtain knowledge and understanding of engineering management principles and economic decision-making, and apply these to work.
(12) Recognize the demand, and have the preparation and ability to engage in independent and life-long learning in the broadest context of technological change.
